太阳能硅片切割技术的研究-solarbe文库

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太阳能硅片切割技术的研究作者刘志东，邱明波，汪炜，田宗军，史勇，王振兴， Liu Zhidong ， Qiu Mingbo ，Wang Wei， Tian Zongjun ， Shi Yong ， Wang Zhenxing作者单位南京航空航天大学机电学院 ,江苏南京 ,210016刊名电加工与模具英文刊名 ELECTROMACHINING Kao I Galerkin-based modal analysis on the vibration of wire-slurry system in waferslicing using a wire saw [外文期刊 ] 20053/52. Willeke G P Thin crystalline silicon solar cells [外文期刊 ] 20021/43. Panek P;Lipi ń ski M;Dutkiewicz J Texturization of multi-crystalline silicon by wet chemical etchingfor silicon solar cells [外文期刊 ] 200564. Pei Z J A study on surface grinding of 300mm silicon wafers 20025. Heeren P H;Reynaerts D;Brussel H V Microstructuring of silicon by electro-discharge machiningEDM-part Ⅱ applications 19976. Leistner A J;Giardini W J High-precision large-diameter single-crystal silicon spherestheirfabrication and measure-ments of sphericity [外文期刊 ] 19957. Reynaerts D;Meeusen W;Brussel H V Machining of three-dimensional Microstructures in silicon by EDM19988. 冈田晃 ;冈本康宽放电を利用した单结晶シリコンインゴットの高能率 *高精度スライシング法の开发 20039. Hideo Takino;Toshimitsu Ichinohe;Katsunori Tanimoto Cutting of polished single-crystal silicon bywire electrical discharge machining [外文期刊 ] 200410. Song X;Reynaerts D;Meeusen W A study on the elimination of micro-cracks in a sparked siliconsurface 200111. HideoTakino;Toshimitsu Ichinohe;Katsunori Tanimoto Contouring of polished single-crystal siliconplates by wire electrical discharge machining 200712. Qian J;Steegen S;Vander Poorten E EDM texturing of multicrystalline silicon wafer and EFG ribbonfor solar cell application 200213. Peng W Y;Liao Y S Study of electrical discharge machining technology for slicing silicon ingots[外文期刊 ] 20031/314. Okada A;Uno Y;Okamoto Y A new slicing method of monocrystalline silicon ingot by wire EDM 199815. Luo Y F;Chen C G;Tong Z F Investigation of silicon wafering by wire EDM [外文期刊 ] 199216. Hideo Takino;Toshimitsu Ichinohe;Katsunori Tanimoto High-quality cutting of polished single-crystal silicon by wire electrical discharge machining [外文期刊 ] 2005417. Song X;Reynaerts D;Meeusen W;Brussel H V A study on the elimination of micro-cracks in a sparkedsilicon surface 2001引证文献 1条1. 刘志东 . 邱明波 . 汪炜 . 田宗军 . 黄因慧大尺寸及异型锗窗高效电火花线切割技术 [期刊论文] -航空学报 20106本文链接 http//d.g.wanfangdata.com.cn/Periodical_djgymj200903015.aspx

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