返回 相似
资源描述：
COMPANY compact machine concept OPEX low machine consumable cost ; jigless concept Plating thickness uniformity within cell and cell-to-cell Capability to integrate resist stripping and etch back processes in one tool CPL Solar Meco’s competitive edge for HJT IBC CONFIDENTIAL 0.5 mm Minor clip mark on IBC cell Meco Solar Plated HJT cells adhesion and lifetime data CONFIDENTIAL Source CSEM, EUPVSEC 2018 lifetime dataPeel strength data Source CSEM, EUPVSEC 2018 CONFIDENTIAL Meco Solar Bifacial heterojunction cell plating CoO model Total plating cost 1.20 USc/Wp Total metallization cost - Cu PVD process -Resist deposition/Plating -Resist stripping etch back 3.65 USc/Wp Bifacial printing of low Temperature Ag paste 6.1 USc/Wp Cost ∆ 2.45 USc/Wp
点击查看更多>>

京ICP备10028102号-1
电信与信息服务业务许可证：京ICP证120154号

地址：北京市大兴区亦庄经济开发区经海三路
天通泰科技金融谷 C座 16层 邮编：102600