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SINGULUS TECHNOLOGIES AG August 2020 - 1 - confidential LineX – inline process equipment 2020-11-5 SINGULUS TECHNOLOGIES AG August 2020 - 2 - confidential Outline Company introduction LINEX Hardware feature LINEX processSINGULUS TECHNOLOGIES AG August 2020 - 3 - confidential Foundation SINGULUS TECHNOLOGIES Ernst Leybold started his business in Cologne Company building 1860 1966 1851 1860 1967 1995 LEYBOLD HERAEUS Vacuum Technology, Metallurgy and Coating Unicorn Pharmacy was founded 1600 in Hanau W.C. Heraeus took over business in 1851 and started with platinum 1851 Merger LEYBOLD / BALZERS History SINGULUS TECHNOLOGIES SINGULUS TECHNOLOGIES AG August 2020 - 4 - confidential SINGULUS TECHNOLOGIES Main Bussiness SINGULUS TECHNOLOGIES AG August 2020 - 5 - confidential SINGULUS TECHNOLOGIES Headquarters in Kahl/Germany 总部 所在地- 法兰克福 HJT PVDSINGULUS TECHNOLOGIES AG August 2020 - 6 - confidential SINGULUS TECHNOLOGIES Manufacturing Location in Fürstenfeldbruck/Germany- HJT batch toolSINGULUS TECHNOLOGIES AG August 2020 - 7 - confidential LINEX -5Lane –5 SINGULUS TECHNOLOGIES AG August 2020 - 8 - confidential LineX -10Lane-10 --- SINGULUS TECHNOLOGIES AG August 2020 - 9 - confidential Hardware design and Feature SINGULUS TECHNOLOGIES AG August 2020 - 10 - confidential LineX – inline process equipment LineX – features overview Available as 5-lane and 10-lane configuration for Wafer size M0, M2, M4, M6, 10.600wph Available as 4-lane and 8-lane configuration for M10, M12 8.200wph Integration of ozone for oxidation and cleaning sequences line polishing or single side etching → NOx free edge isolation single side and immersion bath for etching tunnel oxide formation by using O3 – High uptime up to 99 Low cost of ownership Wafer thickness 80µm – 210µm –-- Low breakage rate down to 0.01 Lowest footprint SINGULUS TECHNOLOGIES AG August 2020 - 11 - confidential 2.5 4.3 LineX – 10 lane process equipment 10 lane - competitor equipment LineX – inline process equipment - 40 Footprint 20SINGULUS TECHNOLOGIES AG August 2020 - 12 - confidential LineX – inline process equipment LineX – design features All parts in chemical resistant material PP, PVDF, PVC, PFA Dosing by feed bleed, time, wafer counter, volume, conductivity, resistivity Dosing accuracy by /-2 Ultrasonic Level sensor for best accuracy Virtual wafer tracking on each lane Integrated waste pump stations Wafer size change possible within 10min / guiding rollers exchange -10 Cleaning sequences optional with O3 Temperature range for drying room temperature up to 60°C Flow simulation of all tanksSINGULUS TECHNOLOGIES AG August 2020 - 13 - confidential LineX – inline process equipment - - 3-4 - 15 LineX – process sequences Rinse HF SSE DI / HF Rinse SSE Alk. DI / KOH Rinse O3 Clean Rinse DiO3 tunnel Oxid Rinse Dry Alk. Single side etch for TopCon → poly-Si wrap around etch Rinse HF SSE Rinse SSE Alk. DI / KOH / Additiv Rinse Metal Clean and BSG etch Rinse Dry edge isolation / backside polish and BSG / PSG removal Pre Clean Rinse Alk. Tex Alk. Tex Rinse Oxid. Clean Rinse Dry SDE and single side texturing flat backside TOPCon Cell with poly-Si wrap around in rainbow collorsSINGULUS TECHNOLOGIES AG August 2020 - 14 - confidential Process Advantage and Feature 1. 2.BSG/PSG 3.TOPCON 4. SINGULUS TECHNOLOGIES AG August 2020 - 15 - confidential LineX – inline process equipment - LineX – process sequences Rinse HF SSE DI / HF Rinse SSE Alk. DI / KOH Rinse O3 Clean Rinse DiO3 tunnel Oxid Rinse Dry Alk. Single side etch for TopCon → poly-Si wrap around etch Rinse HF SSE Rinse SSE Alk. DI / KOH / Additiv Rinse Metal Clean and BSG etch Rinse Dry edge isolation / backside polish and BSG / PSG removal Pre Clean Rinse Alk. Tex Alk. Tex Rinse Oxid. Clean Rinse Dry SDE and single side texturing flat backside SINGULUS TECHNOLOGIES AG August 2020 - 16 - confidential LineX – inline process equipment - LineX – alkaline texturing ▪ Process specification KOH Commercial additive Slurry, diamond-cut, polished wafer surfaces Pyramid size variable 1-6µm on frintside Flat structure without pyramids on backside in one step 3min 80-90°C small Total removal 4-5µm, Reflectance 10 600nm Bath lifetime over 22 million wafers ▪ Process control Replenishment feed bleed Temperature control Reflectance inline Mass loss determination offline Medium 4 – 6 µm Small 1 – 2 µm PERC optimalSINGULUS TECHNOLOGIES AG August 2020 - 17 - confidential Extremely Stable Process Over 90 days-3 - Reflectivity Random choice of 15 days Duration Wafer amount pcs Reflectivity 600 nm Etch amount µm/side 0 h 0 9.8 4.0 0.5 h 4,000 9.6 4.0 1.0 h 8,000 9.5 4.0 2.0 h 16,000 9.4 4.0 3.0 h 24,000 9.2 4.0 4 h – 90 days 32,000 – 17,000,000 9.1 4.0SINGULUS TECHNOLOGIES AG August 2020 - 18 - confidential LineX – inline process equipment –BSG/PSG LineX – process sequences Rinse HF SSE DI / HF Rinse SSE Alk. DI / KOH Rinse O3 Clean Rinse DiO3 tunnel Oxid Rinse Dry Alk. Single side etch for TopCon → poly-Si wrap around etch Rinse HF SSE Rinse SSE Alk. DI / KOH / Additiv Rinse Metal Clean and BSG etch Rinse Dry edge isolation / backside polish and BSG / PSG removal Pre Clean Rinse Alk. Tex Alk. Tex Rinse Oxid. Clean Rinse Dry SDE and single side texturing flat backside SINGULUS TECHNOLOGIES AG August 2020 - 19 - confidential Chemical Saving during Rear Side Polishing SINGULUS TECHNOLOGIES AG August 2020 - 20 - confidential LineX – inline process equipment –TOPCON LineX – Single Side Etching O3 sequences Rinse HF SSE DI / HF Rinse SSE Alk. DI / KOH Rinse O3 Clean Rinse DiO3 tunnel Oxid Rinse Dry Alk. Single side etch for TopCon → poly-Si wrap around etch Rinse HF SSE Rinse SSE Alk. DI / KOH / Additiv Rinse Metal Clean and BSG etch Rinse Dry edge isolation / backside polish and BSG / PSG removal incl oxid formation Pre Clean Rinse Alk. Tex Alk. Tex Rinse Oxid. Clean Rinse Dry SDE and single side texturing flat backside TopCon Cell font and backsideSINGULUS TECHNOLOGIES AG August 2020 - 21 - confidential SINGULUS TOPCon Production Process SDR / Texture / Clean PSG / CEI POCl 3 Diffusion PECVD 3 in 1 PERC p-type SINGULUS TOPCon n-type SDR / Texture / Clean BBr 3 Diffusion BSG / CEI Annealing PECVD 3 in 1 RS PECVD TO and n poly-Si SINGULUS Equipment LINEX / SILEX LINEX GENERIS PECVD LINEX GENERIS PECVD Poly Plasma Oxide and single side PECVD SiN x H , AlO x H PECVD RS PVD TO and n- poly-Si POCl 3 Diffusion GENERIS PVD Poly Plasma Oxide and single side PVD PECVD Option PVD SDR / Texture / Clean Single Side Etching / BSG / Oxidation Single Side Etching poly etching / Cleaning Metallization SDR / Texture / Clean BBr 3 Diffusion BSG / CEI PECVD 3 in 1 Metallization SSE / Cleaning RS PVD TO and n- poly-Si Metallization SSE / CleaningSINGULUS TECHNOLOGIES AG August 2020 - 22 - confidential Bor – Emitter BBr 3 Diffusion LineX alkaline SSE and tunnel oxide Generis PECVD / PVD LineX alkaline SSE LineX /SILEX Inline / batch texturing KOH / Additives LineX – inline process equipment Singulus Equipment for TopConSINGULUS TECHNOLOGIES AG August 2020 - 23 - confidential Batch LINEX ALTEX ✓Inline measurement of each wafer ✓Enabling production big data for higher quality stability Offline measurement by sampling single wafers after certain period Inline sensors at output Offline measurement by operator LineX – inline process equipment - SINGULUS TECHNOLOGIES AG August 2020 - 24 - confidential 总结Singulus 链式设备 优势 1. 10 道设备，大产能-10600 片/ 每小时 2. 设备尺寸 16-20 米长，2.5 米宽，根据不同工艺 3. 省 节能，厂房面积，Hook UP 管道 ，自动化台数，操作工。 4. 单面 制绒，均匀性更好- 反射率9.8 5. 单面 制绒，背面不制绒 更少的抛光- 适合PERC 工艺和TOPCON工艺 6. 工艺稳定 性更好-90 天换液 7. 不需 要花篮等主要耗材- 没有花篮印 8. UPTIME 高-99 9. 结合 臭氧的 清洗和隧道氧化层制备 10. 适合 薄片化的 要求 11. 更适 合大硅片M10 和M12 12. 在线检测- 大数据SINGULUS TECHNOLOGIES AG August 2020 - 25 - confidential THANK YOU FOR YOUR ATTENTION
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